It is ready for batch production
According to industry sources, TSMC is ready to start using the 6th generation Chip-on-Wafer-on-Substrate (CoWoS) packaging technology in mass production. It allows you to assemble a large number of crystals in one package. This is a more cost-effective approach compared to single-chip integration but offers close gains in packaging density and performance over multi-case solutions.
6th generation CoWoS technology allows up to 12 HBM memory stacks to be placed on a common substrate. Assuming they are 16GB HBM2E stacks, the total is an impressive 192GB. Of course, such a microcircuit would impress with the price, but only an example of the technology’s capabilities.